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Embedded Solutions > RISC CPU Module > CMX-Lx45
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| General | |
| Audio | ICH7-M DH supports Intel High-Definition Audio or AC’97 2.3, Clock / Calendar, Real-time clock with 256-byte battery-backed CMOS RAM, Power fail/low battery detector |
| BIOS | AMI Embedded BIOS, Field upgradeable, Multiboot support with boot from HD, CD-ROM, and USB, ACPI Rev. 1.0b, 2.0, and 3.0 compliant, LAN boot (PXE 2.0), PnP, PCI 2.3 compliant, Memory Hole support (15-16 MB), SMBIOS V2.3.3, BIOS Boot Specification (BBS), S.M.A.R.T. support |
| Bus Interface | 533/667MHz Front Side Bus, Supports 533/667MHz DDR2 SDRAM, non-ECC only |
| CPU / Cache | Intel CoreTM2 Duo processor with max speed of 2.16GHz, 4MB L2 cache, and 667MHz Front Side Bus, Intel Celeron M processor with max speed of 1.06GHz, 1MB L2 cache, and 533MHz Front Side Bus, Intel 945GME chipset |
| Data Path | 64-bit, 533/667MHz on CPU, 64-bit, 533/667MHz on memory bus, 2.5GHz x1 PCI Express Links |
| Flash Memory | 8 Mb (1MB) Flash for BIOS field upgrade |
| Form Factor | COM Express Type II Basic Module based on the Intel CoreTM2 Duo and Celeron M processors |
| I/O | 8 USB 2.0 Ports, 2 SATA Ports, Ultra ATA/100 EIDE, Intel 82573E Gigabit Ethernet, 5 PCI Express x1 root ports, configurable as 5x1, or 1x1 and 1x4, 32-bit/33MHz PCI 2.3 bus |
| Mechanical | 125 mm x 95 mm,(4.92” x 3.74” x 0.51” at heat spreader), Conforms to PICMG COM.0 R1.0, COM Express Type II Basic |
| Memory | One 200-pin latching right-angle 1.8V DDR2 SO-DIMM socket, Up to 2GB, PC2-4200/5300 non-ECC DDR2 SDRAM |
| Operating | Temperature: -25° to 70°C / -13° to 158°F, (With appropriate thermal solution. Inquire about extended ranges), Humidity (RNC) : 5 to 95% @ 40°C / 104°F, Altitude: 3,048m / 10,000ft @ 45°C / 113°F, Vibration: 1G 5-500Hz |
| OS Compatibility | Windows 2000, Windows XP, Windows Vista, and Linux, Supervisory, Hardware system monitor (voltages & temps), Watchdog timer (drives a system reset) |
| Peripherals and I/O Interfaces | Eight USB 2.0 ports, Two SATA ports, EIDE: Ultra ATA/100, support for two drives, BMIDE and PIO modes, synchronous DMA mode, transfers up to 100 MB/s, Ethernet: PCI Express Gigabit, Intel 82573E, (with link/activity and speed signals), Five PCI Express x1 links, configurable as 5x1, or 1x1 and 1x4, One 32-bit/33MHz PCI 2.3 bus, supports up to 4 slots/devices |
| Power Requirements | Board Version ICC typical Max. Power Used, 1.06GHz Celeron 1.0A @ +12V 13.8W, 1.06GHz Core2 1.2A @ +12V 17.5W, 1.50GHz Core2 1.5A @ +12V 25.1W, 2.16GHz Core2 2.3A @ +12V 42.1W |
| Regulatory Compliance | Safety: UL/cUL 60950-1:2003, EN/IEC 60950-1:2001, EMC Class A: FCC 47 CFR Part 15-B, CISPR22:1997, EN55022:1998, EN55024:1998 |
| Reliability and Serviceability | MTBF: 376,492 hours @ 25°C, 2 year limited warranty, The reliability prediction was done using Issue 6, Method I, Case 3 of the Bellcore, Industrial Reliability program. |
| Storage and Transit (in approved packaging) | Temperature: -40° to 85°C / -40° to 185°F, Humidity (RNC) : 5 to 95% @ 40°C / 104°F, Altitude: 15,240m / 50,000ft, Shock: 40” free fall, Vibration: Random 5-20Hz @ 1.0 m2/s3; 20-200 -3dB 30 min |
| Video | Intel Gen 3.5 Integrated Graphics Engine, Dynamic Video Memory Technology (DVMT 3.0), Intel Display Power Saving Technology 2.0 (Intel DPST 2.0), Intel Smart 2D Display Technology (Intel S2DDT), Intel Automatic Display Brightness, Dual-channel LVDS flat panel, Analog TV-Out and CRT output, Two SDVO ports, One x16 PCI Express port for external PCI Express-based graphics, card (multiplexed with SDVO), Analog monitor resolution up to 2048 x 1536, Flat panel resolution up to 1600 x 1200 |
| Warranty | Parts and labor covered for 2 years |
Introduction
DTI's CMXLX45 addresses embedded requirements for time-to-market sensitive applications in the military/defense and commercial arenas. The small thin form-factor and scalable performance configurations support both the PCI and PCI Express architectures. Embedded application robustness. Long production life. Diversified Technology's CMXLX45 embedded computer module is a versatile processor solution with its System-On-Module (SOM) design. It will meet the cost-effective and space-limited requirements of the embedded market.
Features:
- 32-bit/33MHz PCI 2.3 bus
- 5 PCI Express x1 rootports, configurable as 5x1, or 1x1 and 1x4
- 533/667MHz DDR2 SDRAM bus
- 533/667MHz FSB
- 8x USB 2.0 Ports
- Bus Interface: 533/667MHz Front Side Bus, 533/667MHz DDR2 SDRAM bus
- COM Express Module based on the Intel Core Duo and Celeron M processors
- CPU/Cache: Intel Core Duo processor with max speed of 2.0GHz, Intel Celeron M processor with max speed of 1.06GHz, Intel 945GME chipset
- Form Factor:COM Express Type II Basic Module based on the Intel Core Duo and Celeron M processors
- Memory: Single SO-DIMM up to 2GB, PC2-4200/5300 non-ECC DDR2 SDRAM
- Physical Dimensions: 125 mm x 95 mm (4.92” x 3.74” x 0.51” at heat spreader)
- Single SODIMM to 2GB
